Exhibit at "40th NEPCON JAPAN"

Insulated heat-dissipating substrates are essential for power modules. Metal substrates, replacing conventional ceramic substrates, offer numerous technical advantages. Nippatsu, a specialist in metal processing, is revolutionizing power modules through metal substrates, enabling miniaturization, high-power capability, and high reliability. This presentation covers thick copper wiring technology exceeding 1.0mm, sinter bonding compatibility, and the latest development trends.

● Thick copper circuits of 0.8mm or greater

• In addition to our proven mass production capability for 0.8mm circuits, we achieve 1mm-class circuits—a challenge for ceramic substrates. At our booth, we showcase 1.2mm circuits. Thick copper circuits enable high-current control. Improved thermal diffusion enhances the heat dissipation efficiency of power modules.

● Status of Support for Sintering Bonding

• We present the progress of reliability testing for our resin-insulated metal substrates regarding sintering bonding (silver sintering), which is increasingly being adopted as an alternative to soldering in substrate assembly.

● Various Newly Developed Products

• 【Busbar-Integrated Substrate】
• 【Low Thermal Resistance Substrate for Discrete SMDs】