Exhibit at "39th NEPCON JAPAN"

Let's throw out ceramic substrates and use metal-based substrates. They are excellent for insulation and heat dissipation, and are also resistant to warping, and thick copper circuits can be formed.

● Balancing insulation, heat dissipation performance and cost

• While ensuring the insulation and heat dissipation properties required for power modules, it is also possible to replace silicon nitride AMB at a cost that is both affordable and competitive.

● Copper circuit of 0.8 mm or more in thickness

• Achieves a 1mm thickness, which is difficult to achieve with ceramic substrates. The thick copper circuit enables control of large currents. The thermal diffusivity is improved, and the heat dissipation efficiency of the power module is increased.

● Enables the use of larger circuit boards

• The work board size is 6 times larger than the ceramic substrate, allowing for highly flexible substrate size design.

● Difference in warping amount

• The amount of warping in the board after heat history, such as chip mounting, is small, making power module assembly easier.