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Thermal simulation
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PROBE SPECS
  • Many testing applications such as Final Test on package and Wafer Level Test needs a comprehensive thermal effect simulation from the design stage.
  • NHK not only provide a FEM analysis to understand the thermal conductance but we are also capable to perform a thermal flow analysis in order to optimize the equipment design.
<Thermal Flow Simulation Example>
  • Optimizing the thermal flow in the test socket.
  • Optimizing the thermal flow in the hand test lid when using a thermo streamer.