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| WLCSP is the technology of packaging and testing an integrated circuit (IC) at wafer level prior to singulation. This WCSLP is suitable for Cell Phone, PDA, and other mobile/portable electronics IC applications to minimize package size. |
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| With fine vertical probe technology, NHKís WLCSP Probe Card is easily capable to test a single IC to multi ICís for further test cost savings. |
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| Probe specs |
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